| 講義 | Track B: AI & High-Speed Digital |
|---|---|
| B1 | Innovating the AI Ecosystem with High-Speed Network Signaling Technologies |
| B2 | Breaking Barriers in Generative AI Deployment: Phison aiDAPTIV+(恕不提供講義下載) |
| B3 | PCB Performance Classification Over Industry by AMD for HPC, Data Center and AI Application(恕不提供講義下載) |
| B4 | Empowering Next-Gen Architectures: Validating Chiplet and Co-Packaged Optics Integration |
| B5 | Pathway to PCIe 6.0/7.0 and CXL 2.0/3.0 from PHY to Protocol |
| B6 | Revolutionizing AI Data Centers with Validated High-Speed Cabling and Interconnects |
| B7 | Accelerating Digital Interface Signal Integrity & Test Automation: USB4, DP2.1, PCIe 5/6 Cases |