|Tracks||Paper Title / Speaker||Abstract|
|Keynote 1||5G: Accelerating Innovation to Connect and Secure the World
Kailash Narayanan, Vice President and General Manager of Wireless Devices & Operators, Keysight Technologies
|Technology now connects everything, and everyone, everywhere. New innovations keep emerging, from smart cities to smart clothing, generating billions of new connections and exabytes of new data. Our world is becoming more connected. And so are we. Everyone wants to be mobile. Yet still we want to be able to get all the right information-instantly. We want to access applications from any platform, and have them be automatically accessible and up to date. The more connected we are, the more challenging it is to meet these expectations. This requires technology beyond what exists today. As a result, technology is evolving across multiple dimensions at once. These trends are putting more pressure on the organizations that create the electronics, communications and networking innovations we rely on every day. In this topic, we will talk the technology trend and how Keysight will help win by innovation.|
|Keynote 2||Towards 5G Enterprise System Solution
Li-Fung Chang, 5G Technology Program Office, Chief Architect, DoIT/MoEA (Ministry of Economic Affairs), Taiwan
|3GPP has released R15 5GNR technical specifications for NSA (Non-Stand Alone) and SA (Stand Alone) on Dec. 2017 and on March 2018, respectively. Though there are still some details to be clarified/specified, operators and vendors are planning to work on interoperability development tests, field tests, pre-commercial trails between now and 2020. From the current progress, it is clear that 5G commercial system will be launched in 2020 by operators in many cities globally as planned.
As 5G is envisioned to offer services to not only traditional applications via smart phones but also different vertical applications via devices/modules (“THINGS”), demonstrations via “THINGS” have been shown in many venues as well. Vertical applications include product lifecycle management, efficient manufacturing in smart factory, robotic arm controls, AR/VR, automotive, etc. Market analysis predicts that vertical applications in the above-mentioned areas will bring tremendous revenue and business opportunities in new services enabled by 5G system. This type of the 5G system can be a customized enterprise system or part of the operator managed system.
In this talk, we will present 4-years Taiwan 5G program funded by MoEA. In particular the end-to-end 5G enterprise system solution, associated applications, business opportunities and challenges will be addressed.
|A-1||5G mmW Radio Access Challenges and Development Trend
Wen Chiang Chen , Deputy Techincal Director, ICL of ITRI
|The 5G (fifth generation) mobile communication standard, the formulation of which is still in incubation, aims to solve the avalanche of traffic volume. One of the promising candidates is to use the millimeter wave frequency band to get the wide available spectrum. To overcome these unfavorable channel properties, i.e. high path loss, propagation loss, rain fading…,e.t.c., the beam-forming, beam tracking together with phased array antenna are the most crucial key technologies. ITRI ICL developed an integrated 38GHz 5G millimeter-wave radio access experiment platform which adopts the hybrid beam-forming architecture designed with a 8-by-8 64-antenna phased antenna array for eNB and a 4-by-8 8-antenna phased antenna array for UE to implement the beam-forming technology, also a beam-tracking algorithm is developed to support the mobile transmission up to 100 m/hr in the outdoor scenario over 100m coverage....|
|A-2||5G NR Update and UE Validation
Jianhua Wu, Sr. Project Manager, Keysight
|Following the ITU-R Workshop on IMT-2020 terrestrial radio interfaces, in October 2017, 3GPP groups are working on the initial description of the 3GPP 5G solution - based on LTE evolution and the first 5G NR specifications approved in December. This topic will provide an update of the technical characteristics of the 3GPP 5G solution. Although this update is not complete and final, it provides a good overview of the contents of 3GPP Release 15. Besides, we will introduce some innovative 5G solutions to help succeed from design to production.|
|A-3||Understanding the 5G NR Physical Layer
Philip Chang, Sr. Project Manager, Keysight
|An initial release of the NR specification was delivered in December'17 with a limited set of functionalities: non-stand-alone connectivity where a NR gNB will always rely on a master LTE eNB, eMBB use cases and the low-latency aspects of URLLC.
With the December release finished, it is an excellent time to have a look at the activity in the standardization bodies to close and finish the remaining aspects of release 15. This topic will discuss the work done in 3GPP since December with a special focus on the implications of stand-alone connectivity and the ultra-reliable aspects of the URLLC case for the NR physical layer.
|A-4||mmWave OTA Fundamentals
Alex Liang, Sr. Application Engineer, Keysight
|5G New Radio will introduce many new challenges for designers. Designing radio devices to operate at cm and mmwave spectrum is no small feat. Considerations including path loss and signal quality at the higher frequencies, connecting and measuring OTA, and increased complexity from Massive MIMO and Beamforming will be key contributors to poor measurements.
In it’s most general sense, Over the Air can mean just about any test which uses radiated measurements. However, the term OTA is distinguishable from other forms of testing with radiated signals since it is more commonly used to describe testing of commercial communications devices (e.g. cellular base stations and user equipment). Other well-known types of testing using radiated signals include antenna test (common in Aerospace & Defense), and EMC (electromagnetic compatibility). This topic will give you a knowledge of OTA test to help 5G product development.
|A-5||5G Channel Model and Channel Emulator Solution
Stephen Chiu, GM of ESBI
|You can breathe me but you can’t see me… air! Let’s explore the importance of the channel for 5G signals, the importance of testing under faded conditions and the challenges this presents. We will also introduce 5G channel model and our new channel emulator solution for 5G.|
|A-6||RAN and Core Network Testing for 5G
Tak Yamakawa, Sr. Manager of Business Development, APAC Keysight
|The new 5G standards and quality of experience (QoE) expectations from your subscribers start at the core of your mobile network. New capabilities require higher cell density. Balancing performance and cost is a critical consideration for new radio access network (RAN) equipment deployment. Besides, Your mobile network is about to experience an unprecedented increase in traffic volume thanks to 5G. This increase will come in many forms so your network core needs to be ready. Massive amounts of bursty machine-type communication need to coexist peacefully with high-bandwidth human subscriber demands. Your RAN and core networks need to scale to handle these dual challenges.This topic will also introduce our massive user equipment (UE) emulation tests your RAN by creating realistic subscriber and application loads, security threats, and dynamic mobility scenarios to accurately predict real-world problems.|
|B-1||LPWAN IoT Application and Challenges
Reggie Sung, Manager of Semtech
|The Internet of Things (IoT) has started to become a reality, and by 2020 billions of services and devices are expected to be connected anytime, anywhere. Smart homes, wearables, smart cities, health care, transportation, agriculture, and smart metering are just a few examples of the different applications that are driving the development of new business models. In this topic, we will give a picture of LPWAN IoT market and the challenges. Then provide a solution to support vertical IoT business.|
|B-2||An Overview of Cellular Internet of Things Technologies and Measuremen
Daphne Hsu, Program Manager, Keysight
|Internet of Things (IoT) is today’s megatrend in wireless communication industry. Machine-to-machine (M2M) wireless connectivity is being adopted in various verticals at increasing pace. The number of IoT devices deployed by 2020 is expected to increase to approximately 20 billion.
Cellular IoT (CIoT) is defined as a set of technologies under the 3GPP umbrella to enable IoT connectivity using the licensed frequencies, co-existing with the legacy cellular broadband technologies, such as LTE, UMTS and GSM. The main CIoT technologies being rolled out globally are NB-IoT and LTE Cat-M1. The term CIoT is used to make the distinction to non-3GPP IoT technologies, such as LoRa and SigFox, which are deployed in unlicensed bands.
IoT applications can be categorized to massive IoT and critical IoT. Massive IoT includes smart metering, home security, etc. The requirements for massive IoT include years of battery life, scalability to very large number of devices, robust coverage, and deep indoor facilities. The NB-IoT technology is optimized for this use case. Critical IoT includes applications, such as health care and connected car, where very low latency levels on ultra-reliable networks, often combined with very high throughput is required. LTE Cat-M1 is optimized to meet these requirements. In this topic, we will talk about CIoT technique and also test solution from design to conformance.
|B-3||Improving 802.11ax Performance in Real World by Comprehensive Test Solution
Brian Su, Sr. Project Manager & Ben Ling, Business Development, Keysight
|With the demand for new usage models and more applications, dense Wi-Fi deployments and more outdoor and public access, extensive effort and work are in progress in IEEE on emerging standards, from 802.11ac to 802.11ax. This topic will discuss the evolution of WLAN technologies along with solutions addressing associated test challenges such as high order modulation, OFDMA and MIMO.
Besides, in real world, you have carefully completed the design, build, and test phases of your new IoT wireless device. Your testing in the lab shows that it meets applicable FCC radio standards, it can connect to the wireless router at your test bench, and it even connects to the site wireless access point (AP) in the office area. But what if your device gets into customer hands and fails to live up to expectations? We will talk "Six Reasons Your New IoT Device Will Fail" and provide a total solution for WiFi product and LTE/WiFi hotspot.
|B-4||Power Challenges for IoT Devices
Brian Chi, Solution Architect, Keysight
|In IoT applications, smart devices and IoT devices need to reduce power consumption as much as possible and extend the battery life. Many products, such as smart meters, smart traffic sensors, etc., have proposed a battery life of up to 10 years! This is not only a power consumption issue, but also the performance of the battery itself which will be a key factor affecting battery life. Therefore, in this topic, we will start with accurate power analysis and optimization, and then focus on battery self-discharge characteristics analysis and screening, in order to achieve the overall goal of extending the battery life of smart devices.|
|B-5||The Future Autonomous Driving Techniques and Test Challenges
Kenny Liao, Sr. Project Manager, Keysight
|This presentation will review enabling technologies of autonomous driving systems, including connected car, automotive radar, and car ethernet as well as introduce Keysight's design and test solutions.|
|B-6||Overcome mmWave Component Test Challenges
Alex Liang, Sr. Application Engineer, Keysight
|With the increased demands for higher speeds, lower latency, and wider bandwidths, designers of 5G solutions are increasingly reaching out to utilize the millimeter wave bands. This is placing special demands on the designs and solutions for testing at these frequencies.
This presentation will explore the tools that enable the performance verification of millimeter wave active devices and will address the challenges with making a single connection measurement for multiple measurements of transceiver modules designed for the 5G environment. We will discuss the measurement of mmW transceivers as well as the measurement of the performance of a millimeter amplifier pair. We will also introduce some new features for mmW PCB and component.
|C-1||Manipulating and Probing Qubit States using Microwave Technologies
PhD. ChiiDong Chen, Research Fellow, Professor of Academia Sinica
|Quantum computing has emerged as an exciting field because of its potentials in cryptography and application-specific computations. It involves coherent superposition states in a two-level system that gives rise to quantum parallelism and entanglement. The two-level system is the basic building block of a quantum computer and is referred to as quantum bit, or qubit. Several implementations of qubits have been developed, including quantum optics, ultracold atoms, nuclear magnetic resonance and solid-state devices. Taking advantages of advanced fabrication techniques for nano-electronics, solid-state qubits possess excellent scalability and have become a major player in the field. In addition to the scalability, solid-state qubits also enjoy high controllability due to strong electromagnetic coupling to the outside world, but it is for the same reason that they suffer from short quantum decoherence time. Superconducting qubits coupled to quantum electromagnetic cavities offer an excellent solution, in which the qubit states are manipulated and probed using microwave techniques, enabling efficient logic operations and high-fidelity readout.
In this presentation, I will first provide a brief introduction to quantum computer. This will be followed by a description of superconducting qubits based on aluminum Josephson junctions and how they are incorporated with GHz superconducting coplanar waveguide circuits. Examples of measurement circuits including microwave apparatus will be given. Finally, approaches for the manipulation and interpretation of qubit states will be discussed.
|C-2||Characterization and Compliance Testing for 400G/PAM4 Designs
Jacky Yu & Francis Liu, Sr. Project Manager, Keysight
|Most 400G links used in high-speed Datacom applications will utilize signaling formats such as pulse amplitude modulation 4-level (PAM4) to achieve design goals set forth by draft standards such as 400G Ethernet (IEEE 802.3bs and IEEE 802.3cd) and OIF-CEI-56G. As new 400G designs transition from simulation to first prototype hardware, engineers are now faced with the challenging task of reviewing the standards in order to develop a test plan. Fortunately, the methods that describe how to characterize 400G transmitter outputs, channel operating margin (COM), and receiver inputs, are becoming more stable.
This presentation covers both electrical and optical compliance testing to the latest drafts of these standards, as well as additional tools for simulation and design validation to assure interoperability.
|C-3||High-speed Digital Interface 4.0 (PCIe、SAS) Insight and Test Solutions in Data Centers
Francis Liu, Sr. Project Manager, Keysight
|With demand on networking and computer performance increasing at a rapid pace, there is a growing need to store, move and process more data in real-time than ever before. As data speeds increase, channel attenuation becomes an inhibitor to moving data across an interface bus. This presentation will highlight Keysight’s contributions with PCIe® 4.0 technology for physical layer transmitter and receiver testing. Topics will include improvements to the PCI Express 3.0 CEM connector to support 16 GT/s signaling, improvements to receiver testing methodologies, and new tools for testing PCI Express 4.0 devices. This session will highlight the work Keysight has been engaged in with the industry to pave the way towards higher bandwidth and throughput in digital systems using PCI Express Gen4 technology.
Serial Attached SCSI – 4 (SAS-4) is the next generation enterprise storage interface that doubles the data throughput from the current SAS-3 standard. SAS-4 has an effective data throughput of 24 Gb/s, and it operates at 22.5 GBaud using a 128b/150b coding scheme that includes Forward Error Correction (FEC). The SAS-4 specification leverages the OIF-CEI 3.1 specification, and present new transmitter and receiver test requirements that deviates from the previous generation SAS standards. For example, the receiver stress signal calibration is no longer based on waveform analysis of the actual stress signal with simulation of a reference receiver characteristic but instead based on a calibration of a transmitter signal of the test equipment and worst case compliant channel. This presentation will provide details to the changes and challenges to testing the new standards.
|C-4||Master the USB 3.1、Thunderbolt 3、DP、HDMI Testing and Overcoming Type-C Challenges
Gary Hsiao, Project Manager, Keysight
|The USB Type-C™ connector is being used in portable device designs because of power networking capabilities as well as for its high speed digital transport using USB 3.1, Thunderbolt, DisplayPort and HDMI technologies. Though flexible, the Type-C interface brings the measurement challenges of multiple standards as well as the complexities of device control to the validation task. Besides each mentioned high-speed digital standards, this presentation will also deal on how to control the USB Type-C interface using a dedicated core solution set. The viewer will understand fundamental capabilities of the interface and how each of the challenges can be addressed to fully characterize any USB Type-C device.|
|C-5||Maximize Your Insight for Validation on MIPI and (LP)DDR Systems
Jacky Yu, Project Manager, Keysight
|The MIPI Alliance has released new C-PHY, D-PHY and M-PHY specifications to address the next generation of the 5G mobile era to include VR(virtual reality), AR(augmented reality) and autonomous vehicle technology. These physical layer specifications are not only double data rate, but also add new features and test specifications. To win in the next generation mobile market with this MIPI PHY, an engineer must understand and prepare for these changes early in the design process. This presentation will explain the specification changes, and the challenges and solutions for testing the new requirements.
DDR4 was the first DRAM technology to break the High Speed Digital paradigm that focuses on signal timing and Voh/Vol/Vih/Vil based noise margin analysis. DDR4 speeds demanded an approach more like what’s used in specifying, designing and testing high speed serial interfaces like SATA, USB 3.0 and PCI-Express (up to Gen 3). Timing and voltage thresholds are replaced by eye diagrams, bit error rates and statistical analysis of random jitter and noise, closing a gap between the DDR specification and the behavior of real systems that opened once DDR3 exceeded 1600MT/s. Many memory designers are still climbing this learning curve that is essential to getting the best performance from DDR4 designs at minimum design risk and cost. Right on the heels of DDR4, DDR5 moves the bar even higher to reach speeds where the data eye is completely closed, requiring advanced equalization techniques to open the eye and assure reliable data transfer. This presentation will help you better understand the concepts underlying the DDR4 specification and get the maximum benefits of having a specification that models real system behavior. Then we will extend the discussion to DDR5, to prepare architects, design, and test engineers to take full advantage of its advanced capabilities.
|C-6||Achieve Your Best Design with SI and PI Concerns
Nash Tu, EEsof Application Engineer, Keysight
|It has become much more important to get higher frequency s-parameters for PCB accurately due to ever increasing data rates. ADS 2017 features a host of new technologies designed to improve accuracy of PCB simulations for both Pre-Layout and Post-Layout, including two electromagnetic (EM) software solutions and a Thermal solver specifically created to help signal and power integrity engineers.
In this topic, you will learn how to design your high speed interconnects keeping the eye-opening within specifications and the new innovative pure EM based SIPro and PIPro composite technologies for designing high speed digital boards. SIPro and PIPro provides a cohesive workflow with ADS for signal integrity and power integrity applications.